International Packaging and Packaging Fair
22-24 November 2023
Packaging, Plastic and Rubber Machinery and Technologies
SNIEC - Shanghai New International Expo Center
swop - Processing and Packaging International Packaging and Packaging Fair will be held on 22-24 November 2023 at the SNIEC - Shanghai New International Expo Center in Shanghai, China.
SWOP, as an integral part of the global packaging industry, is an essential event for the trade fair sectors of food, beverages, confectionery, bakery, pharmaceuticals, cosmetics, non-food, and industrial products. As a member of the interpack alliance, the world's leading packaging fair, SWOP continues to showcase the entire packaging industry chain. In addition, it focuses on youth, intelligence, personalization, new materials, new technologies, sustainability, emerging design trends, and other popular topics. SWOP also serves as a platform for key players in the industry, including packaging manufacturers, brands, OEM/ODM, to discuss cutting-edge concepts and technologies in cutting-packaging. Its aim is to lead the future packaging trends!
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